AOZ1083
The actual junction temperature can be calculated with
power dissipation in the AOZ1281 and thermal
impedance from junction to ambient.
T junction
= ( P total_loss – P diode_loss – P inductor_loss ) × Θ JA
+ T amb
The maximum junction temperature of AOZ1083 is
150 oC, which limits the maximum load current capability.
The thermal performance of the AOZ1083 is strongly
affected by the PCB layout. Care should be taken during
the design process to ensure that the IC will operate
under the recommended environmental conditions.
Several layout tips are listed below for the best electric
and thermal performance.
1. The input capacitor should be connected as close as
possible to the VIN pin and the GND pin.
2. The inductor should be placed as close as possible
to the LX pin and the output capacitor.
3. Keep the connection of schottky diode between the
LX pin and the GND pin as short and wide as
possible.
4. Place the feedback resistors and compensation
components as close to the chip as possible.
5. Keep sensitive signal traces away from the LX pin.
6. Pour a maximized copper area to the VIN pin, the
LX pin and especially the GND pin to help thermal
dissipation.
7. Pour copper plane on all unused board areas and
connect the plane to stable DC nodes, like VIN, GND
or VOUT.
Rev. 1.0 July 2011
www.aosmd.com
Page 9 of 12
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